| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device which inspects the electric properties of an object of inspection such as an semiconductor wafer, is capable of surely carrying out a probe aligning operation after a test head is operated, and inspecting the object of inspection with proper accuracy. SOLUTION: The inspection device 301 for inspecting the object of inspection 111 such as the semiconductor wafer is equipped with a means 311 which senses the movement of the test head 131, and a prober control 120 which automatically controls the position of the mount 112 where the object of inspection 111 is mounted on the basis of the sensing result. COPYRIGHT: (C)2004,JPO
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