发明名称 |
FILM FOR SEMI-IMPREGNATED PREPREG, SEMI-IMPREGNATED PREPREG, AND METHOD FOR PREPARING MOLDED ARTICLE |
摘要 |
PROBLEM TO BE SOLVED: To provide a film for a semi-impregnated prepreg that suppresses the generation of a void and a pin hole even if the molding by the vacuum bag molding is performed and that is easy to impregnate a thermosetting resin in a fiber reinforced material, to provide a semi-impregnated prepreg and to provide a method for manufactuirng a molded article. SOLUTION: The film for the semi-impregnated prepreg comprising the thermosetting resin film 4 containing a foamed bead 6 and the semi-impregnated prepreg having the fiber reinforced material 3 glued to the thermosetting resin film containing the foamed bead are obtained. The fiber reinforced material is comprised of a resin impregnated layer 7 and a non-impregnated layer 8. The semi-impregnated prepreg is laid on one face of the mold, then the bag is folded on the laid semi-impregnated prepreg so that the rim of the bag is airtightly sealed against the mold to exhaust a gas between the bag and the mold, and the semi-impregnated prepreg is cured by heating to prepare the molded article. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004059872(A) |
申请公布日期 |
2004.02.26 |
申请号 |
JP20020223747 |
申请日期 |
2002.07.31 |
申请人 |
TOHO TENAX CO LTD |
发明人 |
KANEKO TORU;UMEMOTO SADATAKA;SASAKI KIYOTO |
分类号 |
C08J5/24;B29C43/10;B29C43/20;B29C70/06;B29K101/10;B29K105/06;B29L9/00;(IPC1-7):C08J5/24 |
主分类号 |
C08J5/24 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|