| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip chip bonder improved in the Z-axis control accuracy of an ultrasonic head and reduced in a pressurizing force without deteriorating a bonding strength, in the flip chip bonder utilizing ultrasonic oscillation. SOLUTION: A Z-slide 11 is provided with a motor 16, a ball screw shaft 18a connected to a motor shaft 16a, a nut 18b fitted to the ball screw shaft 18a, and a Z stage 19 for fixing the nut 18b. The rotation of the motor 16 is converted into a linear motion in Z-direction by the ball screw 18, and the Z stage 19 is supported so as to be movable in the axial direction with respect to a pair of guide bars 25 through a static pressure bearing 24. The ultrasonic head 12 is mounted on the lower end of the Z stage 19 and the ultrasonic head 12 or the like including the Z stage 19 is hung by a pair of coil springs 32 whereby the gravity of these components is canceled. COPYRIGHT: (C)2004,JPO |
