| 摘要 |
PROBLEM TO BE SOLVED: To provide an inorganic powder and a resin composition exhibiting good moldability even when the packing fraction of the inorganic powder is high, yielding little burr in molding and being suitable for obtaining a semiconductor encapsulation material. SOLUTION: The inorganic powder has a kurtosis of its frequency particle size distribution of≤2.9, has a minimal diameter in the range of 15 to <30μm and maximal diameters in the range of 3 to <15μm and 30 to <70μm, and has an average particle diameter of 7 to 40μm. Preferably, the inorganic powder further has a maximal diameter in the range of 0.2 to <1.5μm. The resin composition is obtained by filling a resin with the inorganic powder. COPYRIGHT: (C)2004,JPO
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