METHOD FOR SELECTIVELY REMOVING MATERIAL FROM THE SURFACE OF A SUBSTRATE, MASKING MATERIAL FOR A WAFER AND WAFER PROVIDED WITH A MASKING MATERIAL

摘要

The invention relates to a method for selectively removing material from the surface of a substrate in order to form a recess, comprising the following steps: applying a mask to the surface of the substrate in accordance with the desired selective removal, and; dry etching the substrate, whereby metal, preferably aluminum, is used as a masking material. Energy can be inductively injected into a plasma.