SURFACE-MOUNTED SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

摘要

Disclosed is a surface-mounted semiconductor component comprising a semiconductor chip (1), at least two external electrical connections (3, 4) that are connected in an electrically conducting manner to at least two electrical contacts of the semiconductor chip (1), and a chip cover (5). The two external electrical connections (3, 4) are disposed on a film (2) having a thickness of no more than 100 ñm. The semiconductor chip (1) is fixed to a first main surface (22) of the film (2) while the chip cover (5) is applied to said first main surface (22). Also disclosed is a method for producing such a component.