| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stacked semiconductor device which is reducible in height and thickness even when a plurality of semiconductor elements of the same size are stacked and can be made sufficiently small-sized. <P>SOLUTION: The stacked semiconductor device can have a space for wire connection by arranging a wiring pad 2 of a semiconductor element 1 on a rectangular (or square) widening surface nearby two adjacent sides. Consequently, semiconductor elements 1 can be connected together with only a die bonding material 5 without arranging any dummy element, and a thin stacked semiconductor device can be realized. Further, the number of electrode pads 2 can be made more than that in a case wherein electrode pads 2 are arranged only nearby one side, and the stacked semiconductor device can easily be made multifunctional. <P>COPYRIGHT: (C)2004,JPO |
