发明名称 Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
摘要 A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC chip package, and a local oscillator (LO) multiplier MMIC chip package. Each MMIC chip package includes a base and a multilayer substrate board formed from layers of low temperature transfer tape. The multilayer substrate board has at least three layers and carries RF signals, DC signals, grounding and embedded passive components, including resistors and capacitors. At least one MMIC chip is received on the multilayer substrate board.
申请公布号 US2004036165(A1) 申请公布日期 2004.02.26
申请号 US20030647674 申请日期 2003.08.25
申请人 XYTRANS, INC. 发明人 AMMAR DANNY F.
分类号 H01L23/367;H01L23/538;H01L23/66;H04B1/18;H04B1/40;H05K1/02;H05K1/18;(IPC1-7):H01L21/48;H01L23/34 主分类号 H01L23/367
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