发明名称 HYDROPHILIC REBONDED FOAM AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a hydrophilic rebonded foam easily containing water, and to provide a method for producing the rebonded foam. SOLUTION: The method for producing the rebonded foam comprises a chip-forming step, a chip-storing step, a binder-mixed chip-forming step and a chip-bonding step. A liquid-feeding opening is formed in the wall face of a pipe-shaped body 33 connecting a pulverizing apparatus 21 and a chip-storing vessel 31. In the chip-storing step, a surfactant is attached to the chips under air transportation by feeding an aqueous solution of the surfactant from a liquid-feeding opening of the pipe-shaped body to the interior of the pipe-shaped body 33, and the chips after attachment of the surfactant are stored in the chip-storing vessel. The binder-mixed chip-forming step and the chip-bonding step are applied to the chips after the attachment of the surfactant. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004059766(A) 申请公布日期 2004.02.26
申请号 JP20020221048 申请日期 2002.07.30
申请人 INOAC CORP 发明人 MADOKORO MUTSUO
分类号 C08J9/35;B29C67/20;B29K75/00;(IPC1-7):C08J9/35 主分类号 C08J9/35
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