发明名称 TERMINAL STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a terminal structure in which no leak occurs even when using lead free solder. SOLUTION: A terminal plate 1 has a terminal part 2 which is projected from an outer surface on a base side which is sealed with a sealant of the equipment body of electric equipment. The terminal part 2 is formed by having a thin belt plate material 1a folded back in parallel in the longitudinal direction, the surface is covered with the lead free solder beforehand and a notched part 3 to have the sealant enter is provided inside the folded back part of the terminal part 2. After the terminal plate 1 is installed to the electrical equipment, when the outer surface on the base side from which the terminal part 2 is projected is sealed with the sealant, the sealant is entered into the space inside the folded back part of the terminal 2 from the notched part 3 and a leak passage is shut off. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004063350(A) 申请公布日期 2004.02.26
申请号 JP20020222029 申请日期 2002.07.30
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ONISHI MASAKAZU;HONJO TAKATOSHI
分类号 H01H45/14;H01H9/02;H01H50/14;(IPC1-7):H01H9/02 主分类号 H01H45/14
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