发明名称 Heat sink assembly with fan-driven fluid circulation
摘要 A heat sink assembly for dissipating heat from a CPU (3) includes a computer enclosure (2), a heat sink (10), a container (20), a fan (30), and a tube (40). The container is partly filled with liquid, and is mounted on the heat sink. The fan is mounted in the container and open to a top wall (22) of the container. The enclosure encloses the heat sink the container and the fan therein. The tube is attached to the enclosure, with one end of the tube inserted through the container and engaged with a side of the fan, and an opposite end of the tube engaged with the container. In operation, liquid rises as vapor to the top wall, and condenses into droplets which drop into the fan. The droplets received in the fan are impelled to enter the tube, transfer heat to the enclosure, and return to the container.
申请公布号 US2004035560(A1) 申请公布日期 2004.02.26
申请号 US20030421228 申请日期 2003.04.22
申请人 CHEN YUN LUNG 发明人 CHEN YUN LUNG
分类号 H01L23/427;H01L23/467;(IPC1-7):H05K7/20 主分类号 H01L23/427
代理机构 代理人
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