| 摘要 |
A semiconducting package includes a first capsule, a second capsule and an adhesive within a recess in a surface of the first capsule that secures the first capsule to the second capsule. A method of packaging multiple dice into a semiconducting device includes encapsulating a first die to form a first capsule and encapsulating a second die to form a second capsule, filling a recess in a surface of a first capsule with an adhesive, and securing the first capsule to the second capsule using the adhesive.
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