发明名称 |
Verfahren und Vorrichtung zum Kleben von Platten |
摘要 |
A disk bonding system or method comprises a first element (N1) for forming an annular adhesive layer (35) on an upwardly facing joint surface of a lower side disk (DL), and a second element (N2) for forming a dotted adhesive layer (33) on a downwardly facing joint surface of an upper side disk (DU). Then, a third element sets the upper and lower side disks in a confronting state, and reduces the spacing between the upper and lower side disks until the annular adhesive layer and the dotted adhesive layer are sandwiched between the upper and lower side disks. During this, the annular adhesive layer and the dotted adhesive layer are brought into contact with each other, and the contact region expands in a manner to prevent occurrence of bubbles. <IMAGE> |
申请公布号 |
DE69914251(D1) |
申请公布日期 |
2004.02.26 |
申请号 |
DE1999614251 |
申请日期 |
1999.05.06 |
申请人 |
ORIGIN ELECTRIC CO. LTD., TOKIO/TOKYO |
发明人 |
KOTOYORI, MASAHIKO;YAMAGUCHI, KOJI;NISHIMURA, HIRONOBU;SHINOHARA, SHINICHI;KOBAYASHI, HIDEO;NAKAMURA, MASAHIRO |
分类号 |
B29C65/48;G11B7/26;G11B23/00;(IPC1-7):G11B7/26;B29D17/00 |
主分类号 |
B29C65/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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