| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin for forming a laminate which can simultaneously improve the heat resistance, processability, flame retardance, and insulation properties of the phenolic resin laminate. SOLUTION: By allowing the phenolic resin to have a weight average molecular weight of≥1,000, the flexibility and toughness of the phenolic resin laminate to be manufactured from the phenolic resin are improved. Further, by rendering the weight average molecular weight of≤5,000, and simultaneously rendering the total amount of molecules having a molecular weight of 300-500 not less than 15 wt.%, the distribution amount of low molecular weight components is secured, and when a substrate such as a paper substrate is impregnated with the phenolic resin composition, good impregnation properties are secured. Thereby, heat resistance, flame retardance and insulation properties are improved. COPYRIGHT: (C)2004,JPO |
