| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive printed wiring board that has a small number of patterning treatment processes and can be formed at a low heat-treatment temperature, and to provide a method for manufacturing the printed wiring board. SOLUTION: Embossing using dies is performed to a prescribed position of an insulating base 11 made of a plastic film or the like, and a recess 12 having a prescribed shape and a prescribed depth is formed by embossing work using a die. Additionally, a solvent penetration solution, a coagulation promotion solution, and a metal fine particle solution are prepared. By using a gravure coating machine, the solvent penetration solution, the coagulation promotion solution, and the metal fine particle solution are applied to the recess 12 of the insulating base 11 being embossed in the prescribed shape by using the gravure coating machine; the coating liquid is scraped off by a doctor blade, and drying is successively repeated. Thus, a solvent penetration layer 21, a coagulation promotion layer 31, and a silver fine particle layer 41 are formed, and hence the two-layer double-sided printed-wiring board is obtained with a wiring pattern 50 made of the solvent penetration layer 21, the coagulation promotion layer 31, and the metal fine particle coagulation layer 41 at the recess 12 of the insulating base 11 embossed in the prescribed shape. COPYRIGHT: (C)2004,JPO
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