| 摘要 |
PROBLEM TO BE SOLVED: To improve stability by reducing the defect rate of trimming caused by fusing. SOLUTION: The semiconductor device is formed by forming on the same semiconductor substrate three resistors r1, r2, r3 connected in series, n fuses fa1, fa2, ..., fan connected in parallel to the resistor r2, n fuses fb1, fb2, ..., fbn connected in series with the resistor r3, and trimming terminals ta1, ta2, ta3, ..., tan, tan+1(tb1), tb2, tb3, ..., tbn, tbn+1 for applying a current to blow each fuse. COPYRIGHT: (C)2004,JPO
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