| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning and drying method of semiconductor substrate which can prevent adhesion of particles and generation of water-mark while a cleaning and drying apparatus of one-bus system is used. SOLUTION: The cleaning and drying method includes a substrate cleaning process for cleaning semiconductor wafers 3 with a chemical solution within a cleaning vessel 2 installed within a chamber 1, and a substrate drying process for drying the cleaned semiconductor wafers 3 within the chamber. In the method, a cleaning vessel cleaning process is executed, prior to the substrate cleaning process, to clean the cleaning vessel 2 with the cleaning solution including the oxidation agent such as aqueous solution of hydrogen peroxide. According to this method, the cleaning vessel 2 may be kept within the higher cleanliness. COPYRIGHT: (C)2004,JPO
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