ELECTROLESS PLATING SOLUTION AND ELECTROLESS PLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroless plating solution and an electroless plating method for easily depositing a plating film of uniform film thickness even when a work to be plated is a very small groove or the like. SOLUTION: The electroless plating solution containing metal ions, the complexing agent of the metal ions, and the reducing agent contains a substance of the stability constant (-log K) of the complexing agent of 1.0-8.0, the concentration of the complexing agent of 0.1-2.0 mol/l, and the acid dissociation constant (pK) of 3.0-8.0. COPYRIGHT: (C)2004,JPO