| 发明名称 |
Electroless plating bath composition and method of using |
| 摘要 |
The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices.
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| 申请公布号 |
US2004035316(A1) |
申请公布日期 |
2004.02.26 |
| 申请号 |
US20030649109 |
申请日期 |
2003.08.26 |
| 申请人 |
CHEBIAM RAMANAN V.;DUBIN VALERY M. |
发明人 |
CHEBIAM RAMANAN V.;DUBIN VALERY M. |
| 分类号 |
C23C18/34;C23C18/40;C23C18/44;C23C18/48;C23C18/50;C23C18/52;(IPC1-7):C23C18/34;C23C18/36 |
主分类号 |
C23C18/34 |
| 代理机构 |
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代理人 |
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