| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent defects in mounting of an electronic component caused by the collapse of flatness, in a suction face of a bonding tool because of abrasion or thermal stress, and to shorten image analysis of a thermal cycle and a suction condition of the electronic component. <P>SOLUTION: A tool 4 used for a flip chip bonding apparatus 1 is formed by using black color-based aluminum nitride ceramic. With respect to a tool 4 having a suction face, adjoining a heat unit for heating and used for holing an electronic component at its top by suction in a flip chip bonding apparatus 1, and the bonding tool 4 is formed by using black-based aluminum nitride ceramic. <P>COPYRIGHT: (C)2004,JPO |
