发明名称 SOLDERING FLUX AND SOLDERING PASTE
摘要 PROBLEM TO BE SOLVED: To provide zinc-based flux and solder paste in which the activity is high in spite of non-halogen, any secular changes hardly occur, and solderability is excellent even during the reflow soldering in the atmosphere. SOLUTION: The soldering flux contains 2, 4-diethyl glutaric acid. The solder paste contains the soldering flux and solder powder. The solder paste contains lead-free solder alloy powder. The solder paste contains Sn-Zn solder alloy. In the soldering method using the lead-free solder alloy, the above soldering flux is used. In the soldering method, the above solder paste is used for the soldering. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004058104(A) 申请公布日期 2004.02.26
申请号 JP20020220378 申请日期 2002.07.29
申请人 NOF CORP 发明人 NAKAZATO KATSUMI;SAITO TAKASHI;KATO YUKIHIRO;NAKADA ISAO
分类号 B23K35/363;B23K35/22;B23K35/26;C22C13/00;(IPC1-7):B23K35/363 主分类号 B23K35/363
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