发明名称 HOT WALL HEATING CHEMICAL VAPOR-PHASE GROWTH APPARATUS AND METHOD OF MANUFACTURING EPITAXIAL WAFER USING THE APPAARTUS
摘要 PROBLEM TO BE SOLVED: To manufacture an epitaxial wafer at a low cost which prevents SiC from sticking to the back surface of the wafer and contamination of the inside wall of a reaction tube. SOLUTION: This hot wall heating chemical vapor-phase growth apparatus manufactures an epitaxial wafer by making epitaxial growth on a wafer substrate 2 placed inside the reactive gas flow path 11 of a susceptor 1. It has a first plate 7, bridging the left and right walls 5, 6 of the reactive gas flow path 11, and a second plate 8 disposed on a step 710 formed inside the support hole 70 made on the first plate 7. The wafer substrate 2 is placed on the second plate 8, and epitaxial growth is carried out on the wafer substrate 2. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004063985(A) 申请公布日期 2004.02.26
申请号 JP20020223214 申请日期 2002.07.31
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY;HITACHI LTD;TOSHIBA CORP 发明人 KOJIMA KAZUSATO;TAKAHASHI TETSUO;SUZUKI TAKAYA;NISHIO JOJI
分类号 C23C16/46;H01L21/205;H01L21/68;H01L21/683;(IPC1-7):H01L21/205 主分类号 C23C16/46
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