| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved technology to remove heat from an active area of an integrated circuit device. SOLUTION: The method for removing heat from the active area 104 of the integrated circuit device is provided. A separating body 112 is imparted to the active area 104 of the integrated circuit device. A heat-conductive element 102 is joined to the active area 104 of the integrated circuit device on the outside of the separating body 112. COPYRIGHT: (C)2004,JPO |
