| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively provide a semiconductor device that can stably supply electric power to a semiconductor chip by increasing the number of pins of a semiconductor package without increasing the outside dimension of the package. SOLUTION: This semiconductor device is provided with the package having a top face 2a; a bottom face 2c on the opposite side of the top face 2a, and side faces 2b connecting the peripheral edge sections of the top and bottom faces 2a and 2c to each other; a semiconductor chip 6 provided on the top face 2a; and electrodes 19 which are provided on at least either one of the top face 2a and side faces 2b, electrically connected to the chip 6, and directly connected to external electrodes. This device is also provided with solder balls 7 provided on the bottom face 2c and electrically connected to the chip 6. COPYRIGHT: (C)2004,JPO |
