| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a method of forming a wiring pattern that requires no mask, responds flexibly to a change in the wiring pattern, and wastes no solution in a coating process. <P>SOLUTION: Since a wiring pattern 66 is formed by discharging the droplets of a metallic solution onto an insulating substrate 10, the need for a mask is eliminated. Further, since a thin film is obtained by dispersing the metallic solution into water, a fine wiring pattern can be formed. Moreover, since discharging is performed perpendicularly to the insulating substrate, the wiring pattern is not affected by dust or defects on the insulating substrate and no faulty pattern is formed. After the wiring pattern 66 is dried and is cleaned with water, the droplets of a catalyst solution are discharged thereon. Thus, oxidation-reduction is performed and a conductive layer pattern is formed. A plating solution is applied to the conductive layer pattern to form a metal wiring pattern 68. Further, the metal wiring pattern 68 is formed by copper plating so that the wiring pattern has a high electric conductivity. <P>COPYRIGHT: (C)2004,JPO</p> |
