| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed circuit board that realizes easy separation of the printed circuit board of multilayer structure becoming a product part from the lamination of resin films formed by adhering a plurality of resin films together by a heating/compressing process. <P>SOLUTION: A plurality of slits 30 are formed so as to surround a product region 60 to be used as a product in each of laminated resin films 23. At this time, the product region 60 is held by an outer frame part via a connection part 31 between slits 30. After the slits are formed, application of heat and compression to a plurality of the resin films 23 laminated adheres the resin films 23 in the heating/compressing process. After the heating/compressing process, the printed circuit board 100 of multilayer structure becoming the product part is obtained by breaking the connection part 31 connecting the product region 60 and the outer frame part. <P>COPYRIGHT: (C)2004,JPO</p> |
