发明名称 SEMICONDUCTOR ELEMENT PROVIDED WITH SEALING FILM
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor element provided with a sealing film with excellent moisture resistance. SOLUTION: The semiconductor element is provided with the sealing film in which the hardness value calculated by a micro-pushing testing method is within a range of≥4GPa and≤14GPa. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004063319(A) 申请公布日期 2004.02.26
申请号 JP20020221212 申请日期 2002.07.30
申请人 CANON INC 发明人 HASHIMOTO YUICHI;OSATO YOICHI;AOTA YUKITO;KOIKE ATSUSHI
分类号 H05B33/04;H01L33/48;H01L51/50;H05B33/14;(IPC1-7):H05B33/04;H01L33/00 主分类号 H05B33/04
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