发明名称 |
SEMICONDUCTOR ELEMENT PROVIDED WITH SEALING FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element provided with a sealing film with excellent moisture resistance. SOLUTION: The semiconductor element is provided with the sealing film in which the hardness value calculated by a micro-pushing testing method is within a range of≥4GPa and≤14GPa. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004063319(A) |
申请公布日期 |
2004.02.26 |
申请号 |
JP20020221212 |
申请日期 |
2002.07.30 |
申请人 |
CANON INC |
发明人 |
HASHIMOTO YUICHI;OSATO YOICHI;AOTA YUKITO;KOIKE ATSUSHI |
分类号 |
H05B33/04;H01L33/48;H01L51/50;H05B33/14;(IPC1-7):H05B33/04;H01L33/00 |
主分类号 |
H05B33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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