| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing apparatus for cleaning a chuck by utilizing an existing processing vessel without giving, moreover, any adverse effect on the progress and finish in the intrinsic processing of the wafer. SOLUTION: Carriers 10, each of which is holding a plurality of aligned wafers 80, are suspended with chucks 94, 94 of a robot 90 and are then carried. Cleaning with water is executed at least within one vessel among a plurality of vessels. A water cleaning vessel 50 is used as an overflow vessel for cleaning the wafers by overflowing the cleaning water guided into the vessel. Overflow receptors 53, 53, which are formed to allow temporary overstay of the overflowing cleaning water and dipping of the chuck within the cleaning water, are additionally provided to the water cleaning vessel 50. The chucks 94, 94 are operated at the positions where the carrier 10 is stopped and opened, and the carrier 10 is inserted to the overflow receptors 53, 53. Accordingly, the chuck can be cleaned with the overflow water. COPYRIGHT: (C)2004,JPO |
