| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive tray for semiconductor integrated circuit device the projecting sections of which are hardly broken nor come off and which meets the JEDEC standard, and to provide a method of manufacturing the tray. <P>SOLUTION: The conductive tray for a semiconductor integrated circuit device which houses a semiconductor integrated circuit device and meets the JEDEC standard has a rectangular shape, can be piled upon another tray in a vertically stacked state, and is provided with a semiconductor integrated circuit device housing section and an outer tray frame section surrounding the housing section. The outer tray frame section has a peripheral wall having four external side faces, and is provided with projecting sections on the external side faces. The projecting sections are made of a material which makes the falling height without breakage and coming-off of the projecting sections higher than the falling height without breakage and coming-off of projecting sections made of the same material as that of the semiconductor integrated circuit device and/or outer tray frame section by ≥20 cm. The manufacturing method of the tray are also disclosed. <P>COPYRIGHT: (C)2004,JPO |
