| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the electrode terminal structure of a three dimensional circuit substrate which fills insulating resin simultaneously into a recess provided near the electrode terminal to cure the same in a process for sealing a chip component of IC or the like by the insulating resin and, subsequently, prevents the flow of solder in a reflow soldering process utilizing a property that molten solder does not show wetting property with the insulating resin. <P>SOLUTION: In the terminal structure of the electrode terminal 8, the site of a circuit pattern 5 for preventing at least the flow of conductive paste 4 of solder or the like is formed on the three dimensional circuit substrate 1 so as to have a recessed shape, and the recess 6 is filled with the insulating resin 7 to connect by the conductive paste 4. <P>COPYRIGHT: (C)2004,JPO</p> |
