METHOD AND DEVICE FOR MONITORING DEFECT OCCURRENCE CONDITION

摘要

PROBLEM TO BE SOLVED: To prevent a manufacturing of defective products by detecting an abnormality of a manufacturing device and alarming in early stage. SOLUTION: In a method for analyzing time-series distribution information of defects within the surface of a wafer obtained in an identical inspection process of a manufacturing process of a thin film device for forming the thin film device by sequentially processing the wafer, the occurrence of abnormality in the manufacturing process is determined on the basis of a judgement of local variations in distribution of the defects within the wafer. COPYRIGHT: (C)2004,JPO