| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for the semiconductor package well connecting a package electrode of a semiconductor package with package side electrode part of a contact pin. SOLUTION: Most part of the electrode part 42 in the package side of the contact pin 34 has a slanted part 44 slanted from vertical direction with a prescribed angle. When a land grid array package 21 is housed in a housing, a contact end 45a of the electrode part 42 in the package side contacts with an area of a land electrode 22. When the land grid array package 21 descends, the contact end 45a slides on the surface of the land electrode 22, and removes a foreign matter adhered to the land electrode 22, and the contact end 45a and the land electrode 22 contacts to each other with good contact pressure. COPYRIGHT: (C)2004,JPO
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