发明名称 JOINT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a joint device mountable on a mating member by conducting positioning without looseness and realizing cost reduction in manufacture. SOLUTION: This joint device is constituted by pressing a cylindrical pin ring 38 into a tightening portion 25 of a socket 11 of a ball joint 10 and securing them. The pin ring 38 is inserted into a receiving portion 55 of the mating member 51, so that the socket 11 and the mating member 51 are positioned. The pin ring 38 is formed by injection molding and, by using the resin pin ring 38, looseness can be prevented and noise can be suppressed. Dimensional variation range can be set largely, thus reducing manufacturing cost without need for higher accuracy than necessary. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004060745(A) 申请公布日期 2004.02.26
申请号 JP20020219196 申请日期 2002.07.29
申请人 SOMIC ISHIKAWA INC 发明人 ICHIKAWA HISASHI;HIKITA OSAMU
分类号 B62D7/16;F16C11/06;(IPC1-7):F16C11/06 主分类号 B62D7/16
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