发明名称 DOUBLE LEADFRAME-BASED PACKAGING STRUCTURE AND MANUFACTURING PROCESS THEREOF
摘要 A packaging structure is constructed from a double-leadframe structure that comprises a first and a second leadframe stacked on each other. The first leadframe includes a plurality of first leads that respectively have first outer leads. The second leadframe includes a plurality of second leads that respectively extend into inner leads and second outer leads. The second leadframe is stacked on the first leadframe in a manner that the second outer leads are correspondingly placed over the first outer leads.
申请公布号 US2004036151(A1) 申请公布日期 2004.02.26
申请号 US20030249560 申请日期 2003.04.18
申请人 HSIAO CHUNG-LIANG;HUANG CHIH-KUNG 发明人 HSIAO CHUNG-LIANG;HUANG CHIH-KUNG
分类号 H01L23/057;H01L23/495;H01L23/498;(IPC1-7):H01L23/495 主分类号 H01L23/057
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