发明名称 |
DOUBLE LEADFRAME-BASED PACKAGING STRUCTURE AND MANUFACTURING PROCESS THEREOF |
摘要 |
A packaging structure is constructed from a double-leadframe structure that comprises a first and a second leadframe stacked on each other. The first leadframe includes a plurality of first leads that respectively have first outer leads. The second leadframe includes a plurality of second leads that respectively extend into inner leads and second outer leads. The second leadframe is stacked on the first leadframe in a manner that the second outer leads are correspondingly placed over the first outer leads.
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申请公布号 |
US2004036151(A1) |
申请公布日期 |
2004.02.26 |
申请号 |
US20030249560 |
申请日期 |
2003.04.18 |
申请人 |
HSIAO CHUNG-LIANG;HUANG CHIH-KUNG |
发明人 |
HSIAO CHUNG-LIANG;HUANG CHIH-KUNG |
分类号 |
H01L23/057;H01L23/495;H01L23/498;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/057 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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