BACKSIDE METALLIZATION ON SIDES OF MICROELECTRONIC DICE FOR EFFECTIVE THERMAL CONTACT WITH HEAT DISSIPATION DEVICES

摘要

A microelectronic device and methods of fabricating the same comprising a microelectronic die (144, 144') having an active surface (104), a back surface (106), and at least one side. The microelectronic die side comprises a trench sidewall (124, 124'), a lip (142, 142') and a channel sidewall (140, 140'). A metallization layer (128) is disposed on the microelectronic die back surface (106) and the trench sidewall (124, 124').