| 摘要 |
A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255 DEG C to DEG 275 C temperatures required for soldering modern lead-free solders comprises an intimate mixture of the following components: approximately 2 to 13 per cent by weight of diglycidyl ether bisphenol A resin; approximately 40 to 70% phenol formaldehyde resin and the following further components [(2-methylphenoxy)methyl]-oxirane or o-cresol glycidyl ether)0.5 - 8% by weight; polypropyleneglycol-glycidyl ether resin (plasticizer) 2-10 % by weight; cycloaliphatic polyamine (catalyst) 4 - 15 % by weight; kaolin clay (filler) 2 - 20 % by weight; magnesium alumino silicate (filler) 2 - 15 % by weight; Sb2O3 (filler) 4 - 15 % by weight, and hydrated Al2O3 (filler) 0 - 15 % by weight. |
