Verbinder für Leiterplatte

摘要

To prevent an increase of stresses in soldered portions between terminals and a circuit board during thermal expansion. Movable holding portions 17 which are elastically deformable are formed in a plate main body 13 of an alignment plate 12. The movable holding portions 17 are connected with the plate main body 13 via connection portions 18. Positioning holes 15 for aligning terminals 11 are formed in each movable holding portion 17. Even if the plate main body 13 is displaced with respect to a circuit board P due to thermal expansion with the terminals 11 fitted in and soldered to connection holes of the circuit board P, such a relative displacement is corrected by the elastic deformation of the movable holding portions 17 and the connection portions 18 and, accordingly, the positioning holes 15 are held in specified positions with respect to the connection holes. Therefore, there is no likelihood that stresses in the soldered portions increase due to the displacement of the positioning holes 15 with respect to the connection holes.