| 摘要 |
PROBLEM TO BE SOLVED: To prevent deteriorate connection reliability due to warp of a semiconductor element itself when a thin semiconductor element is connected with the flip-chip connection method. SOLUTION: The method of manufacturing semiconductor device comprises the steps of forming a first semiconductor element to form a plurality of electrode pads 3 to the predetermined positions of a first semiconductor element wafer 1, forming a second semiconductor element to form a plurality of electrode pads 3 to the predetermined positions of a second semiconductor element wafer 2, dividing the first semiconductor element 1a into element pieces, dividing the second semiconductor element 2a into element pieces, forming a bump to the first semiconductor element 1a, connecting the first semiconductor element 2a with a flip-chip connection method, grinding the rear surface of the first semiconductor element 1a, bonding and mounting the second semiconductor element 2, connecting the second semiconductor element 2a with a wire bonding method, sealing the semiconductor element with resin, and dividing the semiconductor devices into device pieces. COPYRIGHT: (C)2004,JPO
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