发明名称 |
SELF-ALIGNED VERTICAL TRANSISTOR DRAM STRUCTURE AND ITS MANUFACTURING METHODS |
摘要 |
A self-aligned vertical transistor DRAM structure comprising a self-aligned trench structure and a self-aligned common-drain structure are disclosed by the present invention, in which the self-aligned trench structure comprises a deep-trench capacitor region having a vertical transistor and a second-type shallow-trench-isolation region being defined by a spacer technique and the self-aligned common-drain structure comprises a common-drain region being defined by another spacer technique. The self-aligned vertical transistor DRAM structure is used to implement two contactless DRAM arrays. A first-type contactless DRAM array comprises a plurality of metal bit-lines integrated with planarized common-drain conductive islands and a plurality of highly conductive word-lines. A second-type contactless DRAM array comprises a plurality of metal word-lines integrated with planarized common-gate conductive islands and a plurality of common-drain conductive bit-lines.
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申请公布号 |
US2004036519(A1) |
申请公布日期 |
2004.02.26 |
申请号 |
US20020223445 |
申请日期 |
2002.08.20 |
申请人 |
INTELLIGENT SOURCES DEVELOPMENT CORP. |
发明人 |
WU CHING-YUAN |
分类号 |
G06F1/04;H01L21/8242;H01L27/02;H01L27/108;(IPC1-7):G06F1/04 |
主分类号 |
G06F1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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