发明名称 |
Wafer handling system |
摘要 |
A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.
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申请公布号 |
US2004037675(A1) |
申请公布日期 |
2004.02.26 |
申请号 |
US20030641807 |
申请日期 |
2003.08.15 |
申请人 |
ZINGER JAN;DE RIDDER CHRISTIANUS G. M. |
发明人 |
ZINGER JAN;DE RIDDER CHRISTIANUS G. M. |
分类号 |
H01L21/68;H01L21/673;H01L21/677;(IPC1-7):B65G1/00 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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