发明名称 |
Via configuration for differential signaling through power or ground planes |
摘要 |
A circuit board including a conductive plane, a first via and a second via. The first and second vias extend through the conductive plane such that there is no conductive material between the first and second vias within the conductive plane.
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申请公布号 |
US2004039859(A1) |
申请公布日期 |
2004.02.26 |
申请号 |
US20020224818 |
申请日期 |
2002.08.21 |
申请人 |
INTEL CORPORATION |
发明人 |
HE JIANGQI;ZHONG DONG;FIGUEROA DAVID G.;LI YUAN-LIANG |
分类号 |
H05K1/02;H05K1/11;(IPC1-7):G06F13/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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