发明名称 Via configuration for differential signaling through power or ground planes
摘要 A circuit board including a conductive plane, a first via and a second via. The first and second vias extend through the conductive plane such that there is no conductive material between the first and second vias within the conductive plane.
申请公布号 US2004039859(A1) 申请公布日期 2004.02.26
申请号 US20020224818 申请日期 2002.08.21
申请人 INTEL CORPORATION 发明人 HE JIANGQI;ZHONG DONG;FIGUEROA DAVID G.;LI YUAN-LIANG
分类号 H05K1/02;H05K1/11;(IPC1-7):G06F13/00 主分类号 H05K1/02
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