ASSEMBLY COMPRISING A SEMICONDUCTOR CHIP AND SUPPORT THEREFOR, IN ADDITION TO METHOD FOR A BONDED WIRING CONNECTION

摘要

The invention relates to an assembly comprising a support (1), which bears a semiconductor chip (3) that is connected to a metallised surface on the rear of the support by means of a through-plating (9). A first nail head contact (4), from which the connection wire has been separated, is formed on the through-plating (9). A second nail head contact (5) is formed on a connection pad of the semiconductor chip (3). The wire (6) that connects the semiconductor (3) to the through-plating (9) runs from said second nail head contact to the first nail head contact (4) and is connected to the latter by means of a wedge contact (7).