发明名称 |
Abrasive used for planarization of semiconductor device and method of manufacturing semiconductor device using the abrasive |
摘要 |
An abrasive for a semiconductor device comprises cerium oxide particles and coating materials. The cerium oxide particles are made principally of cerium oxide (CeO2). The coating materials cover the surface of the cerium oxide particles. |
申请公布号 |
US2004036149(A1) |
申请公布日期 |
2004.02.26 |
申请号 |
US20020269996 |
申请日期 |
2002.10.15 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TAKAYASU JUN |
分类号 |
B24B37/00;C09K3/14;H01L21/304;H01L21/3105;(IPC1-7):H01L29/06 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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