发明名称 |
SEMI-IMPREGNATED PREPREG AND MOLDING METHOD USING THIS PREPREG |
摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg from which a molded product free from residual air and reduced in voids is manufactured, and a manufacturing method using this prepreg. SOLUTION: This semi-impregnated prepreg 1 is composed of a thermosetting resin film 5 and fiber-reinforcing materials 2 and 3 laminated on at least one side of the film 5 and has a projecting fibrous part 9 formed on at least a part of the peripheral end part S of the semi-impregnated prepreg 1. The thermosetting resin film 5 may use a carrier. The prepreg is best-suited for use in vacuum bag molding and autoclave molding processes. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004058610(A) |
申请公布日期 |
2004.02.26 |
申请号 |
JP20020223748 |
申请日期 |
2002.07.31 |
申请人 |
TOHO TENAX CO LTD |
发明人 |
KANEKO TORU;UMEMOTO SADATAKA;SASAKI KIYOTO |
分类号 |
B29B11/16;B29C70/06;B29K105/06;C08J5/24;(IPC1-7):B29B11/16 |
主分类号 |
B29B11/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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