发明名称 CONDUCTIVE PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a conductive pattern forming method which can improve the transfer properties of a conductive paste and position accuracy in transfer. SOLUTION: A pattern groove 25 of a intaglio plate 21 is charged with conductive paste 23 and a uniform adhesion layer 34 is formed over the entire intaglio plate, including a recessed part generated by drying of paste. After the intaglio plate 21 and a transfer object 41 are stuck via the adhesion layer 34, the intaglio plate 21 is peeled and the paste is transferred to the transfer object. Therefore, the paste inside the intaglio plate pattern groove is transferred properly on the object of transfer. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004063943(A) 申请公布日期 2004.02.26
申请号 JP20020222555 申请日期 2002.07.31
申请人 KOA CORP 发明人 KINOSHITA JUN
分类号 H01L21/288;H05K3/20;(IPC1-7):H01L21/288 主分类号 H01L21/288
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