| 摘要 |
PROBLEM TO BE SOLVED: To provide a method wherein a surface masking tape having a rigidity is easily peeled off without giving a fragile member with any damage when the surface masking tape bonded to the fragile member such as a semiconductor wafer. SOLUTION: The surface masking tape is peeled from the fragile member by a method wherein a tape for peeling, having a bending strength which is 0.5-2 times that of the surface masking tape, is bonded to the end of the surface masking tape to pull the tape for peeling into the turning direction of the same, when the surface masking tape is peeled from the surface of the fragile member to which the surface masking tape having the bending strength of 5-100mN is bonded. COPYRIGHT: (C)2004,JPO
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