| 摘要 |
PROBLEM TO BE SOLVED: To avoid inconvenience due to side etching although a subtractive method which can minimize the cost is used to form a printed board. SOLUTION: A circuit pattern 13 is formed on one surface of an insulating layer 10 by using the subtractive method. At least at part of a circuit formation surface of the insulating layer 10, a 2nd insulator layer 20 which is thick enough to bury the circuit pattern 13 is formed by using a material which is not dissolved with a solution for etching the insulator layer 10. The insulator layer 10 at the part where the 2nd insulator layer 20 is formed is etched away with the aforementioned solution to expose the circuit pattern 13 of the part on the reverse side of the circuit formation surface. COPYRIGHT: (C)2004,JPO
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