METHOD OF ETCHING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of etching substrate by which a plurality of substrates can be etched by preventing the sticking of a substrate connecting tape onto circuit patterns by eliminating the sticking error of the tape at the time of connecting the edge sections of adjacent substrates to each other with the tape. SOLUTION: In this method of etching a plurality of substrates transported horizontally by means of a conveying means, the adjacent substrates are connected to each other by only sticking the substrate connecting tape to blank sections in the edge sections of the substrates in the direction perpendicular to the transporting direction of the substrates. COPYRIGHT: (C)2004,JPO