| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic electronic component which can reduce stress in an electrode when the electrode is formed by sputtering to hardly have variation in characteristic due to the stress and also has little deterioration in the tensile strength of a lead terminal. SOLUTION: In the method for manufacturing the ceramic electronic component, electrode films 2 are formed by sputtering on both the surfaces of a plate type ceramic element 1 made of barium-titanate based dielectric ceramic and heat-treated at a temperature of 250 to 400°C, and then lead terminals 4 are joined with the electrode films 2. COPYRIGHT: (C)2004,JPO
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