发明名称 PARTITION AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a high-conductive partition having excellent moldability and being manufactured at a low cost and its efficient manufacturing method. SOLUTION: A section with a high conductive section is exposed by forming a cut section to at least a contact surface section to be conducted in the partition composed of a high-conductive resin composition in which a conductive agent is added to a specific resin. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004060214(A) 申请公布日期 2004.02.26
申请号 JP20020217947 申请日期 2002.07.26
申请人 TORAY IND INC 发明人 UMETSU HIDEYUKI;SHINODA FUMIE;MAKABE YOSHIKI
分类号 E04B2/74;C08K3/00;C08L101/00;(IPC1-7):E04B2/74 主分类号 E04B2/74
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