发明名称 |
PARTITION AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a high-conductive partition having excellent moldability and being manufactured at a low cost and its efficient manufacturing method. SOLUTION: A section with a high conductive section is exposed by forming a cut section to at least a contact surface section to be conducted in the partition composed of a high-conductive resin composition in which a conductive agent is added to a specific resin. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004060214(A) |
申请公布日期 |
2004.02.26 |
申请号 |
JP20020217947 |
申请日期 |
2002.07.26 |
申请人 |
TORAY IND INC |
发明人 |
UMETSU HIDEYUKI;SHINODA FUMIE;MAKABE YOSHIKI |
分类号 |
E04B2/74;C08K3/00;C08L101/00;(IPC1-7):E04B2/74 |
主分类号 |
E04B2/74 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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